Company Filing History:
Years Active: 2003-2005
Title: Koichi Koyano: Innovator in Multi-Chip Module Technology
Introduction
Koichi Koyano is a prominent inventor based in Hadano, Japan, recognized for his significant contributions to multi-chip module technology. With a total of 2 patents to his name, Koyano has continually advanced the field of electronics through his innovative designs and methods.
Latest Patents
Koyano's latest patent focuses on a device for sealing and cooling multi-chip modules. This invention features a sealing top plate made from a ceramic material that exhibits high thermal conductivity and possesses a thermal expansion coefficient matching that of a multi-layer circuit substrate. The innovation incorporates a cooling flow path cover, which is a separate metallic member that encloses cooling flow path grooves. Notably, the back surface of the sealing top plate, which contains the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. Furthermore, a thermal-conductive jacket with low thermal resistance complements the design, while a multi-chip module sealing frame is soldered to the edge of the sealing top plate. To enhance sealing, a material such as an O-ring is interposed between the edge of the sealing top plate and the cooling water path cover, with tightening means employed to secure the assembly.
Career Highlights
Koichi Koyano has dedicated his career to pushing the boundaries of technology at Hitachi, Ltd. His work continues to influence modern electronics, particularly in the efficiency and reliability of multi-chip modules. His innovations not only improve thermal management but also enhance the overall performance of electronic devices.
Collaborations
Throughout his career, Koyano has collaborated with notable coworkers including Takahiro Daikoku and Kenichi Kasai. These collaborations have helped in refining his inventions and promoting advancements in the field, contributing to the success of their projects at Hitachi, Ltd.
Conclusion
In conclusion, Koichi Koyano stands out as a notable inventor in the realm of electronics, with his patents reflecting a deep understanding of thermal management in multi-chip modules. His continued work at Hitachi, Ltd. alongside esteemed colleagues underscores the vital role of collaboration in innovation, paving the way for future advancements in technology.