Kanagawa, Japan

Koichi Igarashi

This inventor holds 13 USPTO granted patents and 3 published patent applications. Top assignees: Sony Corporation, Sony Semiconductor Solutions Corporation, Taiyo Ink Mfg. Co., Ltd.. Active years: 2006-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koichi Igarashi. Retrieved from https://idiyas.com/inventor/koichi-igarashi-tgwiykjo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13 

% Patents Active = 23.1

Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2006-2024

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13 patents (USPTO):Explore Patents

Title: Koichi Igarashi: Innovator in Semiconductor Technology

Introduction

Koichi Igarashi is a prominent inventor based in Kanagawa, Japan, known for his significant contributions to semiconductor technology. With a total of 13 patents to his name, Igarashi has made remarkable advancements in the field, particularly in the design and manufacturing of semiconductor packages.

Latest Patents

Igarashi's latest patents include a semiconductor package and a manufacturing method that effectively reduces thermal resistance of the semiconductor substrate. This innovative package comprises a semiconductor substrate, an insulating layer, a metal layer, an interposer substrate, a mounting substrate, a signal transmission solder ball, and a solder member. A pad is strategically placed on one surface of the semiconductor substrate, while the opposite surface is covered with the insulating layer. The metal layer envelops the insulating layer, and a wire connected to the pad is formed on the interposer substrate. The signal transmission solder ball is joined to both the wire and the mounting substrate, facilitating the transmission of predetermined electrical signals.

Another notable patent is for a solid-state imaging device, which features a package structure that includes a cavity between a solid-state imaging element and a cover member. This design prevents damage caused by increased internal pressure within the cavity during processes such as reflow. The solid-state imaging device consists of a semiconductor substrate with a light-receiving side on one of its plate surfaces, a translucent cover member on the light-receiving side, and a support that holds the cover member in place. Additionally, the semiconductor substrate has a concave portion formed on the opposite plate surface.

Career Highlights

Throughout his career, Koichi Igarashi has worked with notable companies, including Sony Corporation and Sony Semiconductor Solutions Corporation. His work has significantly impacted the semiconductor industry, leading to advancements that enhance the performance and reliability of electronic devices.

Collaborations

Igarashi has collaborated with esteemed colleagues such as Shogo Ono and Minoru Kohno, contributing to the development of innovative technologies in the semiconductor field.

Conclusion

Koichi Igarashi's contributions to semiconductor technology through his patents and collaborations have established him as a key figure in the industry. His innovative designs continue to influence the development of advanced electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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