The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Dec. 09, 2019
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Koichi Igarashi, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
In a semiconductor package in which a semiconductor substrate is mounted, thermal resistance of the semiconductor substrate is reduced. The semiconductor package includes a semiconductor substrate, an insulating layer, a metal layer, an interposer substrate, a mounting substrate, a signal transmission solder ball, and a solder member. A pad is provided on one surface of the semiconductor substrate. A different surface of the semiconductor substrate is covered with the insulating layer. The metal layer covers the insulating layer. A wire to be connected to the pad is formed on the interposer substrate. The signal transmission solder ball is jointed to the wire and the mounting substrate, and transmits a predetermined electrical signal. The solder member is jointed to the metal layer and the mounting substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile