Ritto, Japan

Kohichi Ishimoto

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kohichi Ishimoto. Retrieved from https://idiyas.com/inventor/kohichi-ishimoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Kohichi Ishimoto: Innovator in Slurry Collection Technology

Introduction

Kohichi Ishimoto is a notable inventor based in Rittou, Japan. He has made significant contributions to the field of polishing technology, particularly with his innovative slurry collection device. His work has implications for improving efficiency and effectiveness in various industrial applications.

Latest Patents

Ishimoto holds a patent for a slurry collection device and method. This device features a ring-shaped barrier member surrounding a turntable of a polishing machine, along with a ring-shaped slurry collection container. The design allows for effective collection of slurry, enhancing the performance of polishing machines.

Career Highlights

Ishimoto is associated with International Business Machines Corporation, commonly known as IBM. His role at IBM has allowed him to work on cutting-edge technologies and contribute to advancements in the field of polishing and slurry management.

Collaborations

Ishimoto has collaborated with notable coworkers such as Shunsuke Tanaka and Masami Shinohara. Their combined expertise has fostered innovation and development in their respective projects.

Conclusion

Kohichi Ishimoto's contributions to slurry collection technology exemplify the impact of innovative thinking in industrial applications. His patent and work at IBM highlight the importance of collaboration and creativity in driving advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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