Ogaki, Japan

Kohei Suzuki

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Ibiden Company Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kohei Suzuki. Retrieved from https://idiyas.com/inventor/kohei-suzuki-ea2qktj2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Kohei Suzuki - Innovator in Wiring Substrate Manufacturing

Introduction

Kohei Suzuki is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring substrate manufacturing. His innovative approach has led to the development of a unique method that enhances the efficiency and effectiveness of wiring substrates.

Latest Patents

Kohei Suzuki holds 1 patent for his invention titled "Method for manufacturing wiring substrate." This patent outlines a comprehensive process that includes forming a conductor layer with first and second pads, applying a resin insulating layer, and creating openings that expose the pads. The method also involves the formation of a protective film on the first pad and a conductor post on the second pad, ensuring a robust and reliable wiring substrate.

Career Highlights

Throughout his career, Kohei Suzuki has been associated with Ibiden Company Limited, where he has played a crucial role in advancing wiring substrate technology. His expertise and innovative mindset have positioned him as a key figure in the industry.

Collaborations

Kohei has collaborated with fellow inventor Keisuke Shimizu, working together to push the boundaries of technology in their field.

Conclusion

Kohei Suzuki's contributions to wiring substrate manufacturing exemplify the spirit of innovation. His patented method not only showcases his technical skills but also highlights the importance of collaboration in achieving groundbreaking advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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