Tokyo, Japan

Kodai Murasawa

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 4.3

ph-index = 1


Company Filing History:


Years Active: 2025

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4 patents (USPTO):Explore Patents

Title: The Innovations of Kodai Murasawa

Introduction

Kodai Murasawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of hot-stamping formed bodies. With a total of 4 patents to his name, Murasawa continues to push the boundaries of innovation in his industry.

Latest Patents

Murasawa's latest patents focus on the advancements in hot-stamping formed bodies. One of his notable inventions describes a hot-stamping formed body that possesses a predetermined chemical composition. This body includes a microstructure with residual austenite, where the area ratio is maintained between 20% to 30%. Additionally, it specifies the characteristics of grain boundaries among crystal grains of bainite and tempered martensite, ensuring a specific ratio of rotation angles. Another patent outlines a similar hot-stamping formed body, but with a residual austenite area ratio of 5% to less than 10%. This invention also emphasizes the tensile strength of the hot-stamping formed body, which is designed to exceed 1500 MPa.

Career Highlights

Kodai Murasawa is currently employed at Nippon Steel Corporation, where he applies his expertise in materials engineering. His work has been instrumental in enhancing the performance and durability of steel products through innovative manufacturing processes.

Collaborations

Murasawa has collaborated with notable colleagues, including Yuri Toda and Daisuke Maeda. Their combined efforts have contributed to the advancement of technology in the field of materials science.

Conclusion

Kodai Murasawa's contributions to the field of hot-stamping formed bodies exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of materials science and a dedication to improving industrial applications.

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