The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Feb. 10, 2022
Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Kodai Murasawa, Tokyo, JP;

Shingo Fujinaka, Tokyo, JP;

Yuri Toda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/32 (2006.01); B32B 15/01 (2006.01); C21D 1/18 (2006.01); C21D 6/00 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/08 (2006.01); C22C 38/10 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C22C 38/16 (2006.01); C22C 38/28 (2006.01);
U.S. Cl.
CPC ...
C22C 38/32 (2013.01); B32B 15/011 (2013.01); C21D 1/18 (2013.01); C21D 6/002 (2013.01); C21D 6/005 (2013.01); C21D 6/007 (2013.01); C21D 6/008 (2013.01); C21D 8/0205 (2013.01); C21D 8/0221 (2013.01); C21D 8/0247 (2013.01); C21D 8/0278 (2013.01); C21D 9/46 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/10 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/28 (2013.01); C21D 2211/001 (2013.01); C21D 2211/008 (2013.01);
Abstract

This hot-stamping formed body includes, as a chemical composition, by mass %: C: 0.15% or more and 0.50% or less; Si: 0.10% or more and 3.00% or less; Mn: 0.10% or more and 3.00% or less; P: less than 0.10%; S: less than 0.10%; N: less than 0.10%; Ti: 0.020% or more and 0.150% or less; B: 0.002% or more and 0.010% or less; optionally Al, Cr, Mo, Co, Ni, Cu, V, W, Ca, Mg, and REM; and a remainder including Fe and impurities, in which a microstructure of the hot-stamping formed body includes, by volume fraction, 85% or more of martensite and less than 15% of retained austenite, and in the microstructure, a standard deviation of a frequency distribution of nanohardnesses is 0.70 GPa or less, and an average grain size is 4.0 μm or less.


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