This inventor holds 5 USPTO granted patents and 2 published patent applications and 4 EPO patents. Top assignee: Nitto-Denko Corporation. Active years: 2021-2025.
Company Filing History:
Years Active: 2021-2025
Title: The Innovative Contributions of Kodai Miyamoto
Introduction
Kodai Miyamoto is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the field of conductive films and temperature sensor technology. With a total of 5 patents to his name, Miyamoto continues to push the boundaries of innovation in his industry.
Latest Patents
Miyamoto's latest patents include a conductive film, a method for manufacturing conductive film, and a temperature sensor film. The conductive film features a resin film base with a hard coat layer on one main surface. This innovative design includes an underlying layer made of inorganic dielectric thin film and a metal thin film on top. The hard coat layer contains fine particles with an average diameter of 10 to 100 nm, ensuring that at least 10% of the area is occupied by these particles. Additionally, the electroconductive film is designed with a metal thin film on a resin film base, which is essential for the production of a temperature sensor film. This temperature sensor film is created by patterning the metal thin film to form a thermometric resistor part and a lead part connected to it.
Career Highlights
Miyamoto is currently employed at Nitto Denko Corporation, where he applies his expertise in developing advanced materials. His work has been instrumental in enhancing the performance and functionality of conductive films and temperature sensors.
Collaborations
Miyamoto collaborates with talented coworkers, including Kazuhiro Nakajima and Katsunori Shibuya. Their combined efforts contribute to the innovative projects at Nitto Denko Corporation.
Conclusion
Kodai Miyamoto's contributions to the field of conductive films and temperature sensors highlight his role as a leading inventor in Japan. His innovative patents and collaborations continue to shape the future of technology in this area.