The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Sep. 16, 2020
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Ibaraki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/18 (2006.01); G01K 7/16 (2006.01);
U.S. Cl.
CPC ...
G01K 7/183 (2013.01); G01K 2007/163 (2013.01); G01K 2217/00 (2013.01);
Abstract
An electroconductive film () comprises a metal thin-film () on a first main surface of a flexible substrate () that includes a resin film (). The thickness of the flexible substrate is 1 mm or less. The absolute value |H−H| of the difference between the heating dimensional change rate Hof the electroconductive film and the heating dimensional change rate Hof a film obtained by removing the metal thin-film from the electroconductive film is preferably 0.10% or less. There is a tendency that undulation of a temperature sensor film after patterning of the metal thin-film is further suppressed as the value of |H−H| decreases.