Singapore, Singapore

Kock Hien Eugene Wee


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Kock Hien Eugene Wee: Innovator in Substrate Warpage Reduction

Introduction

Kock Hien Eugene Wee is a notable inventor based in Singapore, recognized for his contributions to the field of substrate processing. He has developed innovative solutions aimed at improving manufacturing processes, particularly in the molding industry.

Latest Patents

Kock Hien Eugene Wee holds a patent for an "Apparatus and method for reducing substrate warpage." This invention provides a method and apparatus designed to minimize warpage of substrates during the molding process. The system includes a conveying device that transports the substrate while applying pressure to maintain its flatness. This innovation allows for the use of conventional substrates and reduces the dependency on material formulation to achieve flatness.

Career Highlights

Kock Hien Eugene Wee is currently employed at Asm Technology Singapore Pte Ltd, where he continues to work on advancements in substrate technology. His expertise in this area has made significant impacts on the efficiency and quality of manufacturing processes.

Collaborations

He collaborates with talented colleagues such as Shu Chuen Ho and Teng Hock Kuah, contributing to a dynamic work environment focused on innovation and problem-solving.

Conclusion

Kock Hien Eugene Wee's work in reducing substrate warpage exemplifies the importance of innovation in manufacturing. His contributions not only enhance production efficiency but also pave the way for future advancements in the industry.

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