The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2006
Filed:
Oct. 18, 2002
Shu Chuen Ho, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
Kock Hien Eugene Wee, Singapore, SG;
Jian Wu, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
Kock Hien Eugene Wee, Singapore, SG;
Jian Wu, Singapore, SG;
ASM Technology Singapore PTE LTD, Singapore, SG;
Abstract
The invention provides an apparatus and method for reducing warpage of a substrate undergoing a molding process, comprising a conveying device for transporting the substrate during molding and pressure means adapted to act on the substrate whereby to maintain the flatness of the substrate. Using the invention, it is possible to provide an apparatus and method which are usable with conventional substrates and which reduce reliance on material formulation to maintain flatness of the substrate.