Ko-Wei Lin

Title: Innovations by Ko-Wei Lin

Introduction

Ko-Wei Lin is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing circuit board designs and improving manufacturing processes.

Latest Patents

One of his latest patents is titled "Circuit board having pad and chip package structure thereof." This invention provides a circuit board that includes a substrate, a conductive pattern, and a solder mask layer. The conductive pattern features a pad, a tail trace, and a signal trace, with specific angles designed to optimize performance. The solder mask layer covers part of the conductive pattern while exposing the pad entirely.

Another significant patent by Ko-Wei Lin is "Substrate having optional circuits and structure of flip chip bonding." This invention relates to a substrate that allows for flexible circuit connections. It includes a substrate body, substrate pads, and conductive traces that can connect to different circuits. This design reduces manufacturing costs by enabling the substrate to be applied to various products based on the desired circuit connections.

Career Highlights

Ko-Wei Lin is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced technologies that enhance the efficiency and functionality of electronic devices.

Collaborations

He collaborates with talented coworkers, including Yun-Hsiang Tien and Kun-Ting Hung, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.

Conclusion

Ko-Wei Lin's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and efficiency in electronic design. His work continues to influence the industry positively.