Company Filing History:
Years Active: 2011
Title: Klaus Kerkel: Innovator in Electrodeposition Technology
Introduction
Klaus Kerkel is a notable inventor based in Neutraubling, Germany. He has made significant contributions to the field of integrated circuit applications, particularly through his innovative methods in electrodeposition.
Latest Patents
Klaus Kerkel holds a patent for a method of electrodepositing a metal in integrated circuit applications. This patent describes a process in which a contact hole to an interconnect in an insulating layer is fabricated. A barrier layer is subsequently applied, followed by a photoresist layer that is irradiated and developed. Using a galvanic method, a copper contact is produced in the contact hole. The process minimizes critical metal contaminations during production, enhancing the reliability of integrated circuits.
Career Highlights
Klaus Kerkel is associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work has been instrumental in advancing technologies that are crucial for modern electronics.
Collaborations
Klaus has collaborated with notable colleagues such as Stephan Bradl and Christine Lindner, contributing to various projects that push the boundaries of technology.
Conclusion
Klaus Kerkel's innovative work in electrodeposition technology has made a significant impact on the field of integrated circuits. His contributions continue to influence advancements in semiconductor technology.