This inventor holds 1 USPTO granted patent. Top assignees: Hyundai Motor Company, Infineon Technologies Ag, Kia Motor Corporation. Active years: 2019.
Company Filing History:
1 out of 20,217 
1 out of 15,016 
1 out of 50 Years Active: 2019
Title: Kiyoung Jang: Innovator in Electronic Packaging Technology
Introduction
Kiyoung Jang is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of electronic packaging technology. His innovative approach has led to the development of a unique patent that enhances the performance of electronic components.
Latest Patents
Kiyoung Jang holds a patent for a "Package with roughened encapsulated surface for promoting adhesion." This invention involves a package that includes at least one electronic chip and a first heat removal body. The heat removal body is thermally coupled to the electronic chip and is designed to efficiently remove thermal energy. The encapsulant encapsulates part of the electronic chip and the heat removal body, with a roughened surface that promotes adhesion.
Career Highlights
Throughout his career, Kiyoung Jang has worked with prominent companies in the technology sector. He has been associated with Infineon Technologies AG and Hyundai Motor Company. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking projects.
Collaborations
Kiyoung Jang has collaborated with notable professionals in his field, including Juergen Hoegerl and Ivan Nikitin. These collaborations have further enriched his work and expanded his impact on electronic packaging technology.
Conclusion
Kiyoung Jang is a distinguished inventor whose work in electronic packaging has led to innovative solutions in the industry. His patent and collaborations reflect his commitment to advancing technology. His contributions continue to influence the field and inspire future innovations.