The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Sep. 20, 2017
Infineon Technologies Ag, Neubiberg, DE;
Hyundai Motor Company, Seoul, KR;
Kia Motor Corporation, Seoul, KR;
Andreas Grassmann, Regensburg, DE;
Juergen Hoegerl, Regensburg, DE;
Kiyoung Jang, Incheon, KR;
Ivan Nikitin, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
HYUNDAI Motor Company, Seoul, KR;
Kia Motor Corporation, Seoul, KR;
Abstract
A package comprising at least one electronic chip, a first heat removal body thermally coupled to a first main surface of the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and part of the first heat removal body, wherein at least part of a surface of the first heat removal body is roughened.