This inventor holds 1 USPTO granted patent. Top assignees: Nippon Steel Corporation, Texas Instruments Corporation. Active years: 1996.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
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Years Active: 1996
Title: Kiyoshi Onodera: Innovator in Bonding Wire Technology
Introduction
Kiyoshi Onodera is a notable inventor based in Kawaguchi, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of bonding wires. His innovative approach has led to advancements that enhance the performance and reliability of electrical connections in semiconductor devices.
Latest Patents
Kiyoshi Onodera holds a patent for a bonding wire with heat and abrasion resistant coating layers. This resin-coated bonding fine wire is designed for forming bonded electrical connections on semiconductor devices. The bonding wire consists of an elongated fine wire made of electrically conductive material, which is covered by first and second non-conductive coating layers. The first coating layer provides excellent insulating properties and heat resistance, while the second layer offers superior abrasion resistance. The first non-conductive coating layer includes at least one aromatic polyester resin, and the second layer is made from materials such as polyurethanes, polyester imides, and polyimides. This multilayer coating structure significantly improves the durability and performance of the bonding wire.
Career Highlights
Throughout his career, Kiyoshi Onodera has worked with prominent companies, including Texas Instruments Corporation and Nippon Steel Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the semiconductor industry.
Collaborations
Kiyoshi Onodera has collaborated with talented individuals such as Hiroyuki Kondo and Kohei Tatsumi. These partnerships have fostered a creative environment that has led to the development of advanced technologies in bonding wire applications.
Conclusion
Kiyoshi Onodera's contributions to bonding wire technology have made a lasting impact on the semiconductor industry. His innovative patent and collaborations with esteemed colleagues highlight his dedication to advancing electrical connection technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile