Texas Instruments Corporation

Nippon Steel Corporation

Kiyoshi Onodera

Hiroyuki Kondo

Kohei Tatsumi

Masao Kimura

A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the bonding wire comprises an elongated fine wire of electrically conductive material, and first and second non-conductive coating layers. The first non-conductive coating layer covers the elongated fine wire and is of a material having good insulating property and heat resistance. The second non-conducting coating layer covers the first non-conductive coating layer and is of a material having good abrasion resistance. The first non-conductive coating layer includes at least one aromatic polyester resins, and the second non-conductive coating layer includes at least one resin selected from the group consisting of polyurethanes, polyester imides and polyimides. The second non-conductive coating layer is built up from a plurality of successive coats to define the second non-conductive coating layer as a non-conductive multilayer coating structure.

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Kawaguchi, Japan

Kiyoshi Onodera