Saitama, Japan

Kiyoshi Ishiba

This inventor holds 1 USPTO granted patent. Top assignee: Lintec Corporation. Active years: 2004.


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Kiyoshi Ishiba: Innovator in Precision Electronics

Introduction

Kiyoshi Ishiba is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of precision electronics through his innovative work. His expertise is particularly evident in the development of specialized adhesive materials.

Latest Patents

Kiyoshi Ishiba holds a patent for an "Adhesive sheet for precision electronic member." This invention addresses the need for low-polluting adhesive solutions in high-temperature environments. The adhesive sheet is designed to generate minimal gas when exposed to elevated temperatures, making it ideal for precision electronic applications. The adhesive layer consists of an acrylic copolymer created from a specific monomer mixture, ensuring high performance and reliability. His patent is a testament to his commitment to advancing technology in a sustainable manner. He has 1 patent to his name.

Career Highlights

Kiyoshi Ishiba is currently employed at Lintec Corporation, where he continues to innovate and develop new materials for electronic applications. His work has garnered attention for its practical applications and environmental considerations.

Collaborations

Kiyoshi collaborates with talented colleagues such as Hiroaki Iwabuchi and Tatsuya Tsukida. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Kiyoshi Ishiba's contributions to the field of precision electronics highlight the importance of innovation in developing sustainable materials. His work not only advances technology but also addresses environmental concerns, making him a key figure in his industry.

Profile summary based on public USPTO records.
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