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For the Inventor, By the Inventor

Plantation, FL, United States of America

Kingshuk Banerji

USPTO Granted Patents = 15

Average Co-Inventor Count = 3.1

ph-index = 11

Forward Citations = 650(Granted Patents)


Company Filing History:

goldMedal15 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1992-1997

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15 patents (USPTO):Explore Patents
1. 5623127 - Single alloy solder clad substrate (1997-04-22),
2. 5573602 - Solder paste (1996-11-12),
3. 5540379 - Soldering process (1996-07-30),
4. 5535101 - Leadless integrated circuit package (1996-07-09),
5. 5499756 - Method of applying a tacking agent to a printed circuit board (1996-03-19),
6. 5446625 - Chip carrier having copper pattern plated with gold on one surface and (1995-08-29),
7. 5429293 - Soldering process (1995-07-04),
8. 5427865 - Multiple alloy solder preform (1995-06-27),
9. 5415944 - Solder clad substrate (1995-05-16),
10. 5311059 - Backplane grounding for flip-chip integrated circuit (1994-05-10),
11. 5293067 - Integrated circuit chip carrier (1994-03-08),
12. 5262674 - Chip carrier for an integrated circuit assembly (1993-11-16),
13. 5203076 - Vacuum infiltration of underfill material for flip-chip devices (1993-04-20),
14. 5166774 - Selectively releasing conductive runner and substrate assembly having (1992-11-24),
15. 5152451 - Controlled solder oxidation process (1992-10-06),

Title: Innovations of Kingshuk Banerji

Introduction

Kingshuk Banerji is a prominent inventor based in Plantation, Florida. He has made significant contributions to the field of electronics, particularly in the development of soldering technologies. With a total of 15 patents to his name, Banerji continues to push the boundaries of innovation in his industry.

Latest Patents

One of his latest patents is for a single alloy solder clad substrate. This invention involves a solder clad printed circuit board that consists of an electrically insulating substrate with copper circuit traces. Portions of these traces are solderable, and a substantially planar layer of a soldering composition is fused to the solderable traces. This forms a solder pad that is not domed. The layer is composed of off-eutectic solder particles that are fused together to create a porous structure. The solder particles are heated to a temperature between the solidus and liquidus temperatures, then cooled to solidify.

Another notable patent is for a solder paste made from solder powder with two different alloys. The individual particles consist of a low melting solder coating that surrounds a nucleus of a higher melting solder. The low melting solder is distinct from the higher melting solder. The particles are suspended in a matrix of a solder paste vehicle, which may also contain a fluxing agent. In one embodiment, the low melting solder is an alloy of 43% tin, 43% lead, and 14% bismuth, while the higher melting solder is an alloy of 52% tin and 48% bismuth.

Career Highlights

Kingshuk Banerji is currently employed at Motorola Corporation, where he applies his expertise in soldering technologies. His work has significantly impacted the electronics industry, enhancing the reliability and performance of electronic components.

Collaborations

Throughout his career, Banerji has collaborated with notable colleagues, including William B. Mullen III and Edwin L. Bradley III. These collaborations have fostered innovation and contributed to the advancement of technology in their field.

Conclusion

Kingshuk Banerji is a distinguished inventor whose work in soldering technologies has led to numerous patents and advancements in the electronics industry. His contributions continue to shape the future of electronic manufacturing.

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