The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 1995
Filed:
May. 02, 1994
Vahid Kazem-Goudarzi, Sunrise, FL (US);
Edwin L Bradley, III, Sunrise, FL (US);
Kingshuk Banerji, Plantation, FL (US);
Henry F Liebman, Tamarac, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A solder-clad printed circuit board (100) has solder particles of one alloy (120) arranged within a matrix of a second solder alloy (115). This arrangement forms a flat structure that is alloyed to the solder pads (105) on the substrate. The solder particles (120) have a predetermined melting temperature and are made from one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The second solder alloy (115) is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight, and the second solder alloy may comprise about 12% by weight of the solder cladding.