Austin, TX, United States of America

Kimiko Nakajima

This inventor holds 1 USPTO granted patent. Top assignee: Paradromics, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kimiko Nakajima. Retrieved from https://idiyas.com/inventor/kimiko-nakajima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kimiko Nakajima and Needle Array Electrode Manufacturing.

Introduction

Kimiko Nakajima is an inventor associated with Paradromics, Inc., in Austin, Texas. Her patent work concerns manufacturing needle array electrodes and integrating them with electronic components.

Latest Patents

Nakajima is associated with 1 patent: “Systems and Methods for Manufacturing Needle Array Electrodes.” The disclosure describes processing source material into elongated features, depositing films on their surfaces, and forming electrical connections between the features and active electronic components. It also outlines creating a needle array and dicing it into an array of discrete electrodes. The films may modify the features’ surface properties to enable or facilitate electrical interconnections.

Career Highlights

The patent reflects work at the intersection of materials processing, electrode-array fabrication, and electronic signal handling. Its manufacturing approach describes how multiple elongated features can be developed into discrete electrodes connected to components that process signals transmitted or received through them.

Collaborations

Nakajima’s listed company affiliation is Paradromics, Inc. The patent describes connections between the electrode structures and active electronic components, but the provided information does not identify additional collaborators.

Conclusion

Kimiko Nakajima’s patent focuses on a manufacturing process for needle array electrodes, combining material processing, surface films, electrical interconnections, and array dicing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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