The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Mar. 01, 2023
Paradromics, Inc., Austin, TX (US);
Michael Landry, Austin, TX (US);
Yifan Kong, Menlo Park, CA (US);
Kunal Sahasrabuddhe, Austin, TX (US);
Kevin Boergens, Chicago, IL (US);
Kim Reid, Austin, TX (US);
Aleksandar Tadić, Austin, TX (US);
Kimiko Nakajima, Austin, TX (US);
Bryan Kerr, Austin, TX (US);
Matthew Angle, Austin, TX (US);
Paradromics, Inc., Austin, TX (US);
Abstract
The present disclosure provides various embodiments of arrays and methods for manufacturing arrays. In one aspect, the present disclosure provides a method for manufacturing arrays. The method may comprise (a) processing a source material to form a plurality of elongated features; (b) depositing one or more films on a surface portion of the elongated features; (c) forming one or more electrical interconnections between (i) the elongated features and (ii) one or more active electronic components for processing one or more signals that are transmitted or received by or through the elongated features; (d) creating a needle array from the plurality of elongated features; and (e) dicing said needle array to form an array comprising a plurality of discrete electrodes. The one or more films may be configured to modify a property of the surface portion of the elongated features to enable or facilitate the one or more electrical interconnections.