Kijun Sung

Title: Kijun Sung: Innovator in Semiconductor Technology

Introduction

Kijun Sung is a notable inventor based in Cheongju-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and patents. His work has implications for the efficiency and functionality of semiconductor packages.

Latest Patents

Kijun Sung holds a patent for a semiconductor package that includes stacked semiconductor chips. This innovative package features a chip stack with multiple semiconductor chips arranged vertically. It incorporates vertical interconnectors that connect to the chips and extend in the vertical direction. The design also includes a molding layer that covers the chip stack and interconnectors while exposing the ends of the vertical interconnectors. Additionally, landing pads are formed over the molding layer to connect with the interconnectors, ensuring electrical connectivity through a package redistribution layer. This patent highlights his expertise in enhancing semiconductor packaging technology. He has 1 patent to his name.

Career Highlights

Kijun Sung is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His role involves research and development, focusing on innovative solutions that advance semiconductor technology. His contributions have been instrumental in the company's ongoing success and reputation in the market.

Collaborations

Kijun has collaborated with notable colleagues, including Chaesung Lee and Jonghoon Kim. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies in the semiconductor field.

Conclusion

Kijun Sung is a prominent figure in semiconductor innovation, with a focus on improving packaging technologies. His patent and work at SK Hynix Inc. reflect his commitment to advancing the industry. His contributions are paving the way for future developments in semiconductor technology.