Kian Shing Tan

Title: Kian Shing Tan: Microelectronics and Wafer-Dicing Innovations.

Introduction

Kian Shing Tan is an inventor associated with semiconductor manufacturing innovations. Based on the information provided, he is located in Singapore and works at Micron Technology Incorporated. His portfolio includes 2 patents related to microelectronic component assembly and wafer dicing.

Latest Patents

Tan’s listed patents address methods and devices for manufacturing and processing semiconductor components.

- **Method of Fabricating Microelectronic Component Assemblies Employing Lead Frames Having Reduced-Thickness Inner Lengths.** This invention describes microelectronic assemblies with leads that have thinner inner sections near component terminals. Bond wires connect the component to the leads, and the design limits how far the wires extend above the component. The disclosure presents assembly configurations and manufacturing methods intended to support compact component designs.

- **Wafer Dicing Device and Method.** This invention describes a two-pass wafer-cutting process. A laser first scribes the wafer, and a mechanical cutter then follows the scribe to complete the cut. The method and device are designed for processing wafers containing multiple dies with integrated circuits.

Career Highlights

Tan’s listed inventions focus on two stages of semiconductor production: assembling microelectronic components and separating dies from wafers. These areas are important to manufacturing processes that require precise connections and controlled cutting.

Collaborations

The information provided identifies Beng Chye Chew and Fong Chun Wai as Tan’s coworkers. It does not specify their roles in the listed inventions or patents.

Conclusion

Kian Shing Tan’s patent portfolio reflects work on microelectronic assembly and wafer-dicing techniques, connecting component design with practical semiconductor manufacturing processes.