Ki Sung Jung

Title: Ki Sung Jung: Innovator in Semiconductor Assembly

Introduction

Ki Sung Jung is a prominent inventor based in Gunpo-si, South Korea. He has made significant contributions to the field of semiconductor assembly, holding a total of 3 patents. His work focuses on developing advanced bonding film compositions that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Ki Sung Jung's latest patents include innovative solutions for die bonding film compositions. One of his notable patents is a bonding film composition for semiconductor assembly, which incorporates an elastomer resin containing hydroxyl, carboxyl, or epoxy groups. This composition also features a film-forming resin with a glass transition temperature (Tg) ranging from about 0 to 200°C, along with an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler. Another significant patent is an adhesive film composition that includes a polyester-based thermoplastic resin and an elastomer resin, among other components, aimed at improving the performance of die packages.

Career Highlights

Ki Sung Jung is currently employed at Cheil Industries Inc., where he continues to innovate in the semiconductor field. His expertise in bonding film technology has positioned him as a key player in the industry, contributing to advancements that support the growing demand for high-performance semiconductor devices.

Collaborations

Throughout his career, Ki Sung Jung has collaborated with talented individuals such as Wan Jung Kim and Yong Woo Hong. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor assembly.

Conclusion

Ki Sung Jung's contributions to the semiconductor industry through his innovative patents and collaborations highlight his role as a leading inventor. His work continues to influence the advancement of semiconductor technologies, ensuring greater efficiency and reliability in electronic devices.