The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Jul. 19, 2007
Yong Woo Hong, Suwon-si, KR;
Su MI Im, Uiwang-si, KR;
Wan Jung Kim, Suwon-si, KR;
Ki Sung Jung, Gunpo-si, KR;
Chang Beom Chung, Yongin-si, KR;
Yong Woo Hong, Suwon-si, KR;
Su Mi Im, Uiwang-si, KR;
Wan Jung Kim, Suwon-si, KR;
Ki Sung Jung, Gunpo-si, KR;
Chang Beom Chung, Yongin-si, KR;
Cheil Industries, Inc., Gumi-si, Gyeongsangbuk-do, KR;
Abstract
A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile