Ki Gon Kim

Title: Ki Gon Kim: Innovator in Printed Circuit Board Technology

Introduction

Ki Gon Kim is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards. His innovative designs have paved the way for advancements in electronic component packaging.

Latest Patents

Ki Gon Kim holds a patent for a printed circuit board and electronic component package. This patent describes a printed circuit board that includes a substrate layer with multiple insulating layers and wiring patterns. The substrate layer features a conductive via layer that connects wiring patterns on the upper and lower surfaces of the insulating layer. Additionally, the design includes an uppermost substrate layer with an outermost insulating layer and a first upper wiring pattern. A bump pad is also incorporated, which is shorter than the first upper wiring pattern.

Career Highlights

Ki Gon Kim is currently employed at Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with other talented professionals and contribute to cutting-edge technology in printed circuit boards.

Collaborations

Some of Ki Gon Kim's coworkers include Suk Chang Hong and Yong Duk Lee. Their collective expertise enhances the innovative environment at Samsung Electro-Mechanics Co., Ltd.

Conclusion

Ki Gon Kim's contributions to printed circuit board technology exemplify the spirit of innovation in the electronics field. His patent reflects a commitment to advancing electronic component packaging, showcasing his role as a key inventor in this domain.