The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
May. 13, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Suk Chang Hong, Suwon-si, KR;
Yong Duk Lee, Suwon-si, KR;
Sang Hoon Kim, Suwon-si, KR;
Ki Gon Kim, Suwon-si, KR;
Woo Jeong Choi, Suwon-si, KR;
Cheol Min Shin, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A printed circuit board includes: a substrate layer in which a plurality of insulating layers and a plurality of wiring patterns are repeatedly layered, the substrate layer including a conductive via layer disposed in one of the plurality of insulating layers to connect wiring patterns, among the plurality of wiring patterns, disposed on upper and lower surfaces of the one insulating layer, respectively; an uppermost substrate layer including an outermost insulating layer disposed outermost within the substrate layer, and a first upper wiring pattern disposed in the outermost insulating layer; and a bump pad disposed on a portion of an upper surface of the first upper wiring pattern and having a length shorter than a length of the first upper wiring pattern.