This inventor holds 1 USPTO granted patent. Top assignee: Hynix Semiconductor Inc.. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: Innovations by Ki Chae Kim in Semiconductor Technology
Introduction
Ki Chae Kim is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that addresses common challenges in semiconductor packaging.
Latest Patents
One of Ki Chae Kim's key patents is titled "Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same." This invention presents a substrate designed to minimize distortions in semiconductor packages. The substrate comprises a substrate body, an insulation layer, and a reinforcing member. The substrate body features a first region with multiple chip mount areas and a second region along the periphery. Each chip mount region contains a circuit pattern, while the second region includes a dummy pattern. The insulation layer covers both regions and has openings that expose parts of the circuit patterns. The reinforcing member is strategically placed in the second region to prevent deflection of the substrate body, enhancing the reliability of semiconductor packages.
Career Highlights
Ki Chae Kim is currently employed at Hynix Semiconductor Inc., a leading company in the semiconductor industry. His work focuses on developing advanced materials and methods that improve the performance and durability of semiconductor devices. With a patent portfolio that includes 1 patent, he continues to push the boundaries of innovation in his field.
Collaborations
Ki Chae Kim has collaborated with talented colleagues such as Young Hy Jung and Jae Sung Oh. Their combined expertise contributes to the advancement of semiconductor technologies and the successful implementation of innovative solutions.
Conclusion
Ki Chae Kim's contributions to semiconductor technology exemplify the importance of innovation in enhancing device performance. His work not only addresses existing challenges but also paves the way for future advancements in the industry.