Company Filing History:
Years Active: 2015
Title: Innovations of Khiam How Low
Introduction
Khiam How Low is an accomplished inventor based in St. Charles, MO (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer polishing.
Latest Patents
Khiam How Low holds a patent for a method titled "Single side polishing using shape matching." This innovative technique involves determining a removal profile for polishing a wafer. The process includes measuring the starting wafer profile, polishing the wafer, and then measuring the polished wafer profile. By comparing these profiles, the removal profile is computed, allowing for precise control over the material removed during polishing.
Career Highlights
Khiam How Low is currently employed at SunEdison Semiconductor Limited. His work focuses on advancing semiconductor manufacturing processes, contributing to the efficiency and effectiveness of wafer production.
Collaborations
Some of his notable coworkers include Sumeet S Bhagavat and Ichiron Yoshimura, who collaborate with him on various projects within the semiconductor industry.
Conclusion
Khiam How Low's innovative approach to wafer polishing exemplifies the advancements being made in semiconductor technology. His contributions continue to impact the industry positively.