The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Mar. 13, 2013
Applicant:

Memc Electronic Materials, Inc., St. Peters, MO (US);

Inventors:

Sumeet S. Bhagavat, St. Charles, MO (US);

Khiam How Low, St. Charles, MO (US);

Ichiron Yoshimura, Utsunomiya, JP;

John Allen Pitney, St. Charles, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/10 (2006.01); B24B 37/005 (2012.01); B24B 49/03 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 49/03 (2013.01);
Abstract

A method of polishing a wafer is disclosed that includes determining a removal profile. The wafer is measured to determine a starting wafer profile and then the wafer is polished. The wafer is again measured after being polished to determine a polished wafer profile. The starting wafer profile and the polished wafer profile are compared to each other to determine the removal profile by computing the amount and shape of material removed from the first wafer during polishing.


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