Company Filing History:
Years Active: 2020
Title: **Kevin Wen-Huan Tung: Innovator in Chemical Mechanical Polishing Technology**
Introduction
Kevin Wen-Huan Tung, based in Taichung, Taiwan, is an accomplished inventor known for his significant contributions to the field of semiconductor manufacturing. With a focus on improving the precision and efficiency of chemical mechanical polishing (CMP) processes, his work has important implications for the electronics industry.
Latest Patents
Kevin holds a patent for a novel CMP polishing pad designed for use on metal surfaces found in semiconductor wafers. His invention provides methods for CMP polishing that enhance the quality of copper and tungsten-containing metal surfaces. The innovative polishing pad features a top polishing surface created from a reaction product of an isocyanate terminated urethane prepolymer and a specific polyol curative. This combination ensures low water uptake and promotes coplanarity of metal and dielectric or oxide layer surfaces, resulting in reduced defectivity and minimized dishing.
Career Highlights
Kevin is currently associated with Rohm and Haas Electronic Materials CMP Holdings, Inc., where he develops techniques and materials to advance semiconductor fabrication processes. His work not only exemplifies technological advancement in the field but also reinforces the company's commitment to innovation in electronic materials.
Collaborations
Throughout his career, Kevin has collaborated with talented coworkers such as Bainian Qian and Fengji Yeh. These partnerships enable cross-pollination of ideas and enhance the development of new technologies that push the boundaries of semiconductor processing.
Conclusion
Kevin Wen-Huan Tung stands out as a pivotal figure in innovation within the semiconductor industry. His patent for a chemical mechanical polishing pad exemplifies his dedication to enhancing the quality and efficiency of manufacturing processes. With ongoing collaboration and a commitment to research and development, Kevin continues to influence advancements in technology that will shape the future of electronic materials.