Company Filing History:
Years Active: 2005
Title: Kevin Wade Hampton: Innovator in Die Thinning Methods
Introduction
Kevin Wade Hampton is an accomplished inventor based in Eau Claire, Wisconsin. He has made significant contributions to the field of semiconductor technology, particularly in die thinning methods. His innovative approach has led to the development of a patented technique that enhances the efficiency of integrated circuit manufacturing.
Latest Patents
Kevin holds a patent for a die thinning method that involves several key steps. This method includes providing a wafer and depositing a substrate bonding material on it. The process places a plurality of die on the wafer, cures the substrate bonding material to secure the individual integrated circuits to the base wafer, and covers both the substrate and the die with a mask material. The substrate bonding material used is BCB, while the mask material is a photoresist. The method further involves back grinding the wafer to remove excess material and reduce the original die thickness from 26 mils to 5 mils. A UV transfer tape is applied to the die on a film frame, and after the mask material and back grinding tape are removed, the die are placed face down in a UV cure station. The UV transfer tape is then irradiated, allowing for the removal of the die from the tape.
Career Highlights
Kevin Wade Hampton is currently associated with Union Semiconductor Technology Corporation, where he continues to innovate in the semiconductor industry. His work focuses on improving manufacturing processes and enhancing the performance of integrated circuits. With a patent portfolio that includes one significant patent, Kevin demonstrates his commitment to advancing technology in his field.
Collaborations
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Conclusion
Kevin Wade Hampton is a notable inventor whose contributions to die thinning methods have the potential to impact the semiconductor industry significantly. His innovative techniques and dedication to improving manufacturing processes highlight his role as a key figure in technological advancements.