The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Nov. 30, 2003
Kevin Wade Hampton, Eau Claire, WI (US);
Kevin Wade Hampton, Eau Claire, WI (US);
Union Semiconductor Technology Corporation, Plymouth, MN (US);
Abstract
A die thinning method includes providing a wafer () and depositing a substrate bonding material on the wafer. The die thinning method places a plurality of die () on the wafer (), cures the substrate bonding material to secure the individual ICs to the base wafer (), and covers the substrate () and the die () with a mask material. The substrate bonding material is BCB. The mask material is a photoresist (). The method further back grinds the wafer to remove the wafer and to reduce the original die thickness from 26 mils to 5 mils. A UV transfer tape () is applied to the die () on a film frame (). The mask material and back grinding tape () are then removed. The plurality of die (), UV transfer tape (), and film frame () are placed face down in a UV cure station. The UV transfer tape () is UV irradiated and the plurality of die () are removed from the UV transfer tape ().