This inventor holds 1 USPTO granted patent. Top assignee: Freescale Semiconductor,inc.. Active years: 2015.
Company Filing History:
Years Active: 2015
Title: Innovations in Semiconductor Manufacturing: The Work of Kevin P. Ginter
Introduction
Kevin P. Ginter, based in Apache Junction, AZ, is a notable inventor recognized for his contributions to semiconductor manufacturing. With a focus on improving the efficiency and effectiveness of semiconductor processes, Ginter has secured one significant patent that showcases his expertise and innovative approach in the field.
Latest Patents
Ginter's patent, titled "Methods for removing adhesive layers from semiconductor wafers," introduces various embodiments aimed at enhancing the semiconductor manufacturing process. The invention discusses a method for releasing a transparent carrier from a semiconductor wafer assembly, which includes a semiconductor wafer embedded with multiple semiconductor devices. The process involves an adhesive layer, a carrier release layer, and the transparent carrier. Notably, the method controls a laser system to emit a beam characterized by specific laser parameters to compromise the integrity of the adhesive layer, allowing it to be efficiently removed from the wafer.
Career Highlights
Currently, Kevin P. Ginter is associated with Freescale Semiconductor, Inc., a prominent company within the semiconductor industry. His innovative work contributes to advancements in manufacturing techniques, addressing critical challenges faced by engineers and manufacturers in creating high-performance semiconductor devices.
Collaborations
Throughout his career, Ginter has collaborated with fellow inventors and engineers, including notable colleagues Colby Greg Rampley and Jeffrey Lynn Weibrecht. These collaborations have likely contributed to the exchange of ideas and enhancements in various semiconductor technologies.
Conclusion
In summary, Kevin P. Ginter's work exemplifies the ongoing innovation within the semiconductor sector. His patented methods for removing adhesive layers from wafer assemblies represent a significant advancement in the field, underlining the importance of continued research and development in semiconductor manufacturing processes. As Ginter and his colleagues pursue further innovations, the implications for the industry are promising, paving the way for enhanced efficiency and performance in semiconductor applications.