Kevin K Lin

Title: Kevin K Lin: Innovator in Wafer Level Packaging Technology

Introduction

Kevin K Lin is a notable inventor based in Apopka, FL (US). He has made significant contributions to the field of electro-mechanical device packaging, holding a total of 4 patents. His work focuses on innovative methods for packaging materials with varying coefficients of thermal expansion.

Latest Patents

One of his latest patents is titled "Wafer level packaging of materials with different coefficients of thermal expansion." This invention describes an electro-mechanical device package that includes a cap material permanently bonded to a device wafer, encapsulating an electromechanical device. An intermediate material is utilized to bond the device and capping material together at a low temperature. The structure, which includes the intermediate material emanating from either the device or cap material, provides an interlocking at the bonding interface. Additionally, one package features a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material, along with a low-cost cap wafer made from a different material than the device wafer. The method for temporarily bonding the cap material to the carrier wafer involves attaching the cap material to the carrier wafer, which is then singulated to mitigate thermal expansion mismatch with the device wafer.

Another significant patent is the "Method of assembling a wafer-level package filter." This invention includes a device wafer with an acoustic wave device on its surface, which features at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. The capped substrate contains circuitry with inductors and capacitors, and it has a coefficient of thermal expansion that is significantly different from that of the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer, encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over part of the capped substrate, and a metallization layer extends over a portion of the dielectric layer, connecting the capped substrate circuitry to the connecting pad of the acoustic wave device.

Career Highlights

Throughout his career, Kevin K Lin has worked with prominent companies in the semiconductor industry, including Triquint Semiconductor Corporation and Sawtek, Inc. His experience in these organizations has contributed to his expertise in the field of wafer-level packaging.

Collaborations

Kevin has collaborated with notable professionals such as George Grama and Jack Chocola, further enhancing his innovative work in the industry.