The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Jun. 14, 2004
Michael T. Mcclure, Winter Park, FL (US);
Jack Chocola, Lake Mary, FL (US);
Kevin K. Lin, Apopka, FL (US);
George Grama, Oviedo, FL (US);
Michael T. McClure, Winter Park, FL (US);
Jack Chocola, Lake Mary, FL (US);
Kevin K. Lin, Apopka, FL (US);
George Grama, Oviedo, FL (US);
Sawtek, Inc., Orlando, FL (US);
Abstract
An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.