Kevin Byrd

Title: Kevin Byrd: Innovator in Integrated Circuit Technology

Introduction

Kevin Byrd is a notable inventor based in Portland, Oregon. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique patent that enhances the efficiency of electronic assemblies.

Latest Patents

Kevin Byrd holds a patent for "Through-substrate underfill formation for an integrated circuit assembly." This patent describes a method for fabricating an integrated circuit package by disposing an underfill material between an electronic substrate and an integrated circuit device through an opening in the electronic substrate. The assembly includes an electronic substrate with a first surface and an opposing second surface, featuring at least one opening that extends from the first surface to the second surface. The integrated circuit device is electrically attached to the electronic substrate with at least one interconnect, and the underfill material is strategically placed to enhance the assembly's performance.

Career Highlights

Kevin Byrd is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to explore innovative solutions in integrated circuit design and assembly.

Collaborations

Throughout his career, Kevin has collaborated with talented professionals, including Eng Huat Goh and Kyle Davidson. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Kevin Byrd's contributions to integrated circuit technology exemplify the spirit of innovation. His patent and work at Intel Corporation highlight his commitment to advancing electronic assembly techniques. His achievements continue to influence the field and inspire future innovations.