Kevin A Lindamood

Title: Kevin A Lindamood: Innovator in Silicon Wafer Dicing Technology

Introduction

Kevin A Lindamood is a notable inventor based in Pittsburgh, PA (US). He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of silicon wafer dicing. His innovative approach has led to advancements that enhance the efficiency and precision of the dicing process.

Latest Patents

Kevin holds a patent for a method of back cutting silicon wafers during a dicing procedure. This improved back cut method is designed for separating multiple printheads formed in a silicon wafer. The process involves directing infrared light into the wafer, which is then reflected back through the wafer from alignment fiducial marks. A CCD camera mounted on a dicing saw detects the reflected light, allowing for precise alignment with the fiducial coordinates stored in memory. This method enables a back cut operation that partially cuts through the composite wafer, followed by a dicing step that separates individual printheads from the wafer. Kevin's patent is a testament to his innovative thinking and technical expertise.

Career Highlights

Kevin A Lindamood is associated with Xerox Corporation, where he has applied his skills and knowledge to develop cutting-edge technologies. His work has not only contributed to the company's success but has also advanced the field of semiconductor manufacturing.

Collaborations

Throughout his career, Kevin has collaborated with talented individuals such as David J Collins and Lawrence H Herko. These collaborations have fostered an environment of innovation and creativity, leading to the development of impactful technologies.

Conclusion

Kevin A Lindamood is a distinguished inventor whose work in silicon wafer dicing technology has made a significant impact in the semiconductor industry. His innovative methods and collaborations continue to drive advancements in this critical field.