Taoyuan, Taiwan

Keui-Sheng Wu

This inventor holds 1 USPTO granted patent. Top assignee: Unimicron Technology Corporation. Active years: 2024.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Keui-Sheng Wu: Innovator in Connector Technology

Introduction

Keui-Sheng Wu is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of connector technology, showcasing his innovative spirit through his patented inventions.

Latest Patents

Wu holds a patent for a "Connector and method for manufacturing the same." This invention features a connector that includes a substrate, a coverlay, and a spring contact. The substrate has a first surface, a second surface opposite to the first surface, and a conductive through hole extending between the two surfaces. The coverlay is positioned on the first surface and contains a first opening. The spring contact consists of an anchor member, a rising member, and a pin. The anchor member is situated between the substrate and the coverlay, while the rising member extends from the anchor member through the first opening, with part of it inside and part outside the opening. The pin connects the anchor member to the conductive through hole, ensuring electrical connectivity.

Career Highlights

Keui-Sheng Wu is associated with Unimicron Technology Corporation, where he continues to develop innovative solutions in connector technology. His work has contributed to advancements in the industry, enhancing the functionality and reliability of connectors.

Collaborations

Wu has collaborated with notable colleagues, including Ching-Ho Hsieh and Ming-Hsing Wu, to further his research and development efforts.

Conclusion

Keui-Sheng Wu's contributions to connector technology exemplify his innovative mindset and dedication to advancing the field. His patent reflects a significant step forward in connector design, showcasing his expertise and commitment to innovation.

Profile summary based on public USPTO records.
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