Toshima-ku, Japan

Kento Watanabe

This inventor holds 1 USPTO granted patent. Top assignees: Heraeus Epurio LLC, Heraeus Kabushiki Kaisha, Soken Chemical & Engineering Co. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kento Watanabe. Retrieved from https://idiyas.com/inventor/kento-watanabe-0qs1aw8q

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Kento Watanabe: Patent Activity and Adhesive Technology.

Introduction

Kento Watanabe is an inventor associated with Toshima-ku, Japan. His listed patent concerns adhesive materials designed to combine optical transparency, antistatic performance, and compatibility with low-polarity solvents or dispersion media.

Latest Patents

Watanabe is credited with 1 patent: “Adhesive Composition and Adhesive Sheet.” The invention describes an adhesive composition containing an adhesive polymer, a conductive polymer complex, and a nonaqueous solvent or dispersion medium. The conductive complex includes a conjugated polymer and a polyanion with a block copolymer structure. The patent’s stated objective is to provide materials that dissolve or disperse stably in low-polarity media while maintaining high total light transmittance and effective antistatic properties.

Career Highlights

Watanabe’s listed company affiliations include Soken Chemical & Engineering Co., Ltd., and Heraeus Epurio LLC. His patent reflects work on functional adhesive formulations that address both optical and electrical performance requirements.

Collaborations

Tomohiro Miyazaki and Syuji Okamoto are identified as Watanabe’s coworkers. Their names are associated with his professional and patent-related context.

Conclusion

Kento Watanabe’s recorded patent focuses on transparent, antistatic adhesive compositions and sheets, highlighting an approach that combines adhesive polymers with conductive polymer technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…