The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Aug. 10, 2017
Soken Chemical & Engineering Co. Ltd., Toshima-ku, JP;
Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;
Heraeus Kabushiki Kaisha, Bunkyo-ku, JP;
Tomohiro Miyazaki, Toshima-ku, JP;
Kento Watanabe, Toshima-ku, JP;
Syuji Okamoto, Toshima-ku, JP;
Wilfried Lövenich, Hanau, DE;
Armin Sautter, Hanau, DE;
Tetsuya Suzuki, Bunkyo-ku, JP;
SOKEN CHEMICAL & ENGINEERING CO. LTD., Tokyo, JP;
HERAEUS EPURIO GMBH, Hanau, DE;
HERAEUS KABUSHIKI KAISHA, Tokyo, JP;
Abstract
An object of the present invention is to provide an adhesive composition and an adhesive sheet that are stably dissolved or dispersed in a solvent or a dispersion medium having low polarity, have high total light transmittance and have high-function antistatic properties. An adhesive composition including (A) an adhesive polymer comprising repeated structures which consist of one or more kinds of (meth)acryl-based, urethane-based, silicone-based and polyolefin-based unit structures, (B) a conductive polymer complex including a conjugated polymer, and a polyanion having a block copolymer structure, and (C) a nonaqueous solvent or dispersion medium, in which the conductive polymer complex is contained by 0.1 parts by mass or higher and lower than 10 parts by mass relative to 100 parts by mass of the adhesive polymer.