Company Filing History:
Years Active: 2022-2025
Title: Kentaro Wada: Innovator in Printed Wiring Board Technology
Introduction
Kentaro Wada is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 4 patents. His innovative designs have advanced the capabilities and efficiency of electronic components.
Latest Patents
Wada's latest patents include groundbreaking designs for printed wiring boards. One of his patents describes a printed wiring board that features an insulating layer, a first conductor layer, an adhesive layer, a resin insulating layer, and a second conductor layer. This design ensures that the first conductor layer has a smooth upper surface and side surface, enhancing the overall performance of the board. Another patent focuses on a printed wiring board that incorporates a resin insulating layer with embedded particles. This innovative approach allows for a unique ratio of exposed and covered surfaces, optimizing the functionality of the wiring board.
Career Highlights
Kentaro Wada is currently employed at Ibiden Company Limited, where he continues to develop cutting-edge technologies in the electronics sector. His work has been instrumental in pushing the boundaries of what is possible in printed wiring board design.
Collaborations
Wada collaborates with talented coworkers such as Tomoyuki Ikeda and Satoru Kawai. Together, they contribute to the innovative environment at Ibiden Company Limited, fostering advancements in technology.
Conclusion
Kentaro Wada's contributions to printed wiring board technology exemplify his dedication to innovation. His patents reflect a commitment to enhancing electronic components, making him a notable figure in the field.