This inventor holds 1 USPTO granted patent. Top assignee: Sumitomo Electric Industries, Limited. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Kenta Imakita: Innovator in Printed Wiring Board Technology
Introduction
Kenta Imakita is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of printed wiring board technology. His innovative work has led to the development of a unique substrate that enhances the performance and reliability of printed wiring boards.
Latest Patents
Kenta Imakita holds 1 patent for his invention titled "Substrate for Printed Wiring Board and Printed Wiring Board." This patent describes a substrate that includes a base film with a first and second main surface, conductive layers, and electroless copper plating layers. The design features a through hole extending through the base film, which is crucial for its functionality.
Career Highlights
Kenta Imakita is currently employed at Sumitomo Electric Industries, Limited, where he continues to innovate in the field of electrical engineering. His work focuses on improving the materials and processes used in printed wiring boards, contributing to advancements in electronic devices.
Collaborations
Kenta has collaborated with talented coworkers such as Takuto Hidani and Katsunari Mikage. Their combined expertise fosters a creative environment that drives innovation within their projects.
Conclusion
Kenta Imakita's contributions to printed wiring board technology exemplify the spirit of innovation. His patent and ongoing work at Sumitomo Electric Industries, Limited, highlight his commitment to advancing the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile