The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Mar. 17, 2023
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A substrate for a printed wiring board comprises: a base film having a first main surface and a second main surface; a first conductive layer disposed on the first main surface; a second conductive layer disposed on the second main surface; a first electroless copper plating layer disposed on the first conductive layer; a second electroless copper plating layer disposed on the second conductive layer; and a third electroless copper plating layer. In the base film, a through hole extending through the base film along a thickness direction of the base film is formed. The third electroless copper plating layer is disposed on an inner wall surface of the through hole. An amount of palladium in the base film at each of the first main surface and the second main surface is smaller than an amount of palladium in the base film at the inner wall surface.