Yokosuka, Japan

Kensho Miyata

This inventor holds 3 USPTO granted patents. Top assignees: Nippei Toyoma Corp., Toyobo Co., Ltd., Other. Active years: 1998-2000.


% Patents Active = 100.0

Average Co-Inventor Count = 10.0

ph-index = 3

Forward Citations = 47(Granted Patents)


Location History:

  • Yokosuka, Kanagawa, 239, JP (1998)
  • Yokosuka, JP (2000)

Company Filing History:

goldMedal2 out of 2 
 
Nippei Toyoma Corp.
 patents
silverMedal2 out of 397 
 
Toyobo Co., Ltd.
 patents
bronzeMedal1 out of 834,411 
Other
 patents
where one patent can have more than one assignee

Years Active: 1998-2000

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3 patents (USPTO):Explore Patents

Title: Innovations by Kensho Miyata in Slurry Management Systems

Introduction

Kensho Miyata is a notable inventor based in Yokosuka, Japan. He has made significant contributions to the field of slurry management systems, particularly in applications involving wire saws. With a total of 3 patents to his name, Miyata's work focuses on optimizing the properties of slurry used in cutting processes.

Latest Patents

Miyata's latest patents include a slurry managing system and a slurry managing method designed for wire saws. The managing system efficiently handles slurry supplied to a wire saw, which is essential for cutting workpieces. The slurry is prepared in a tank and sent to the wire saw for cutting. After the cutting process, the used slurry is directed to a separating apparatus that removes impurities. This process recovers a mixture of recyclable dispersing liquid and abrasive grains, which is then returned to the preparing tank. The system also detects the specific gravity and viscosity of the slurry, allowing for adjustments in the amount of fresh abrasive grains and dispersing liquid added to ensure optimal cutting properties.

Another patent focuses on a slurry managing system specifically for wire saws. This system includes a wire with multiple parallel lines and utilizes a mixer device to combine the slurry before it is supplied to the wire saw. The system features first and second supplying devices for grains and dispersing liquid, respectively, along with adjusting devices to control the amounts supplied. This innovation allows for the simultaneous production of multiple wafers during the cutting process.

Career Highlights

Throughout his career, Kensho Miyata has worked with reputable companies such as Nippei Toyama Corporation and Toyobo Co., Ltd. His experience in these organizations has contributed to his expertise in slurry management technologies.

Collaborations

Miyata has collaborated with notable coworkers, including Kazutomo Kinutani and Noboru Katsumata. Their combined efforts have further advanced the innovations in slurry management systems.

Conclusion

Kensho Miyata's contributions to slurry management systems demonstrate his commitment to enhancing cutting technologies. His innovative patents reflect a deep understanding of the complexities involved in managing slurry for wire saw applications.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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