The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1998
Filed:
Oct. 01, 1996
Kensho Miyata, Yokosuka, Kanagawa, 239, JP;
Kazutomo Kinutani, Yokosuka, Kanagawa, 239, JP;
Noboru Katsumata, Yokosuka, Kanagawa, 239, JP;
Kensho Kuroda, Yokosuka, Kanagawa, 239, JP;
Toyotaka Wada, Yokosuka, Kanagawa, 239, JP;
Akihiro Nakayama, Yokohama, Kanagawa-ken 236, JP;
Katsumasa Takahashi, Yokohama, Kanagawa-ken 236, JP;
Takaharu Nishida, Osaka, Osaka-fu 530, JP;
Shouichi Uemura, Ohtsu, Shiga-ken 520-02, JP;
Tetsuo Kodama, Ohtsu, Shiga-ken 520-02, JP;
Other;
Abstract
A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.