This inventor holds 1 USPTO granted patent. Top assignee: Toyobo Co., Ltd.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Kensaku Maeda: Inventor of an Advanced Polyamide Resin Composition.
Introduction
Kensaku Maeda is an inventor associated with Toyobo Co., Ltd. in Shiga, Japan. His listed patent focuses on a polyamide resin composition designed to combine strong mechanical performance with improved processing and durability. Maeda is credited with 1 patent in the information provided.
Latest Patents
Maeda’s listed invention is “Polyamide Resin Composition and Polyamide Resin Molded Article.” The composition contains a polyimide resin, a modified styrene-based copolymer, a modified high-density polyethylene, and an aliphatic metal salt. It is specified to have a melt mass flow rate of at least 20 but less than 60 grams per 10 minutes, along with an equilibrium water absorption rate below 3% at 65% relative humidity.
The patent describes a material intended to produce molded articles with high resistance to fatigue under continuous load, strong mechanical characteristics, and high fluidity. These properties may help reduce short shots and preserve the strength of welded parts, including in large or thick molded articles. The composition is also described as having excellent mold release and improved abrasion resistance.
Career Highlights
The available information connects Maeda’s inventive work with Toyobo Co., Ltd. and highlights his contribution to polymer materials for molded products. His patent addresses several manufacturing and performance considerations, including flow during molding, fatigue resistance, weld strength, mold release, and abrasion resistance.
Collaborations
Ryo Umeki and Yoshitaka Ayuzawa are identified as Maeda’s coworkers. The provided information does not specify their roles in the patent or the nature of their collaboration.
Conclusion
Kensaku Maeda’s listed patent presents a polyamide resin composition designed to support durable, mechanically capable molded articles while addressing practical molding challenges.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
