The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Sep. 09, 2020
Applicant:

Toyobo Co., Ltd., Osaka, JP;

Inventors:

Yoshitaka Ayuzawa, Shiga, JP;

Kensaku Maeda, Shiga, JP;

Ryo Umeki, Shiga, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/00 (2006.01);
U.S. Cl.
CPC ...
C08L 77/00 (2013.01); C08L 2205/03 (2013.01);
Abstract

A polyamide resin composition containing a polyimide resin (A), a modified styrene-based copolymer (B), a modified high-density polyethylene (C), and an aliphatic metal salt (D), and having a melt mass flow rate (MFR) of 20 g/10 minutes or more and less than 60 g/10 minutes and a 65% RH equilibrium water absorption rate of less than 3%. The polyamide resin composition can form a molded article having a sufficiently high limit of fatigue against continuous load, achieve high mechanical characteristics and high fluidity to prevent the occurrence of a short shot or decrease in the strength of a welded part even in a large and/or thick molded article, and has excellent mold releasability and more excellent abrasion resistance than ever before.


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