This inventor holds 1 USPTO granted patent. Top assignee: A-Sat Corporation. Active years: 2006.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2006
Title: Kenneth Kwan and Leadless Chip Carrier Innovation.
Introduction
Kenneth Kwan is an inventor associated with Hong Kong, CN, and A-Sat Corporation. His patent work concerns semiconductor packaging, specifically a leadless plastic chip carrier designed with standoff contacts and a die attach pad.
Latest Patents
The provided information identifies one patent for Kenneth Kwan: “Leadless Plastic Chip Carrier with Standoff Contacts and Die Attach Pad.” The invention describes a fabrication process that selectively etches and plates a leadframe strip, mounts a semiconductor die, connects it to contact pads with wire bonds, and encapsulates the assembly in molding material. Further selective etching defines the contact pads and die attach pad, after which the carrier is separated from the leadframe strip. This approach integrates the contacts and die attach pad into a compact leadless package.
Career Highlights
Kwan’s listed patent activity reflects work in semiconductor packaging and leadframe-based manufacturing. The supplied data associates him with A-Sat Corporation and records 1 patent.
Collaborations
The provided information names Wing Him Lau and Janet Wong as Kwan’s coworkers. It does not specify their roles in the patent or describe particular collaborative contributions.
Conclusion
Kenneth Kwan’s recorded invention focuses on a manufacturing process for a compact leadless plastic chip carrier, highlighting his contribution to semiconductor packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile